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  • » Articles posted by admin

    Patent Granted for Apparatus and Method for Processing Sputtered IC Units

    • By admin
    • News
    • Posted on 14 Nov, 2019
    news-2

    Patent Granted for Apparatus and Method for Processing Sputtered IC Units

    • By admin
    • News
    • Posted on 14 Nov, 2019
    Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Apparatus and Method for Processing Sputtered IC Units” has been officially Continue Reading 

    Patent Granted for Processing System and Method for Large Scale Substrates

    • By admin
    • News
    • Posted on 9 Sep, 2019
    news-1

    Patent Granted for Processing System and Method for Large Scale Substrates

    • By admin
    • News
    • Posted on 9 Sep, 2019
    Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Processing System and Method for Large Scale Substrates” has been officially Continue Reading 

    Semicon Taiwan 2019

    • By admin
    • Events
    • Posted on 4 Sep, 2019
    events-1

    Semicon Taiwan 2019

    • By admin
    • Events
    • Posted on 4 Sep, 2019
    Visit us at Semicon Taiwan 18th – 20th Sep, 2019 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# :N0886  Continue Reading 

    Patent Granted for Improved Dry Block Assembly

    • By admin
    • News
    • Posted on 29 May, 2019
    news-2

    Patent Granted for Improved Dry Block Assembly

    • By admin
    • News
    • Posted on 29 May, 2019
    Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Improved Dry Block Assembly” has been officially granted in Singapore as Patent No. Continue Reading 

    Semicon SEA 2019

    • By admin
    • Events
    • Posted on 16 Apr, 2019
    events-1

    Semicon SEA 2019

    • By admin
    • Events
    • Posted on 16 Apr, 2019
    Visit us at Semicon South East Asia 07th – 09th May, 2019. Venue: MITEC , Level 1 Hall 2 & Hall 3, Kuala Lumpur, Malaysia (Booth #807)  Continue Reading 

    Patent Granted for A Unit Lifter Assembly

    • By admin
    • News
    • Posted on 26 Mar, 2019
    news-1

    Patent Granted for A Unit Lifter Assembly

    • By admin
    • News
    • Posted on 26 Mar, 2019
    Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “A Unit Lifter Assembly” has been officially granted in Thailand under the Continue Reading 

    Semicon China 2019

    • By admin
    • Events
    • Posted on 28 Feb, 2019
    events-1

    Semicon China 2019

    • By admin
    • Events
    • Posted on 28 Feb, 2019
    Visit us at Semicon China 20 – 22 Mar, 2019 Venue: Shanghai New International Expo Center at Hall N3, Booth# 3779  Continue Reading 

    Patent Granted for Assembly and Method for IC unit engagement

    • By admin
    • News
    • Posted on 21 Nov, 2018
    news-2

    Patent Granted for Assembly and Method for IC unit engagement

    • By admin
    • News
    • Posted on 21 Nov, 2018
    Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in South Continue Reading 

    Semicon Taiwan 2018

    • By admin
    • Events
    • Posted on 14 Aug, 2018
    events-1

    Semicon Taiwan 2018

    • By admin
    • Events
    • Posted on 14 Aug, 2018
    Visit us at Semicon Taiwan 05th – 07th Sep, 2018 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# :L700Continue Reading 

    Patent Granted for Method and Apparatus for Improved Sorting of Diced Substrates

    • By admin
    • News
    • Posted on 26 Jul, 2018
    news-1

    Patent Granted for Method and Apparatus for Improved Sorting of Diced Substrates

    • By admin
    • News
    • Posted on 26 Jul, 2018
    Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been Continue Reading 
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    Established in 1992, Rokko is a precision engineering group principally engaged in the business of providing automated equipment and precision engineering services to customers in the semiconductor and electronics industries. The Group has 3 major business segments – Auto Vision and Robotics, Advanced Materials & Electrochemistry, and Precision Engineering.
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