Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in South Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assemby and Method for IC Unit Engagement ” has been officially granted Continue Reading 

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Dicing System and Method ” has been officially granted in Philippines Continue Reading 

Rokko has been providing precision engineering services to more than 100 clients in the semiconductor and automotive industries since 1992 PUBLISHED by SCMP : Wednesday, 09 August, 2017 www.scmp.com →Continue Reading 

Rokko Technology, the Tooling division of Rokko Holdings is pleased to report that its patent related to tooling assembly system entitled ‘Punch Singulation System and Method’ has been officially granted in Philippines as Patent No.1-2012500635 Continue Reading