Semicon Taiwan 2018
Visit us at Semicon Taiwan 05th – 07th Sep, 2018 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# :L700Continue Reading
Patent Granted for Method and Apparatus for Improved Sorting of Diced Substrates
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been Continue Reading
Semicon SEA 2018
Visit us at Semicon South East Asia 22nd – 24th May, 2018. Venue: MITEC , Level 1 Hall 2 & Hall 3, Kuala Lumpur, Malaysia (Booth #512)Continue Reading
Semicon China 2018
Visit us at Semicon China 14th – 16th Mar, 2018 Venue: Shanghai New International Expo Center at Hall N3, Booth# 3239Continue Reading
Patent Granted for Assembly and Method for IC Unit Engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assemby and Method for IC Unit Engagement ” has been officially granted Continue Reading
Patent Granted for Dicing System and Method
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Dicing System and Method ” has been officially granted in Philippines Continue Reading
Semicon Taiwan 2017
Visit us at Semicon Taiwan 13th – 15th Sep, 2017 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# 707/709Continue Reading
Rokko underscores R&D strength as high-value precision engineer and technology partner
Rokko has been providing precision engineering services to more than 100 clients in the semiconductor and automotive industries since 1992 PUBLISHED by SCMP : Wednesday, 09 August, 2017 www.scmp.com →Continue Reading
Patent Granted for Punch Singulation System and Method
Rokko Technology, the Tooling division of Rokko Holdings is pleased to report that its patent related to tooling assembly system entitled ‘Punch Singulation System and Method’ has been officially granted in Philippines as Patent No.1-2012500635 Continue Reading
Patent Granted for A Conversion Kit
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “A Conversion Kit” has been officially granted in Republic of the Thailand as Continue Reading
Have a question?
Call our staff OR drop us an email
