Semicon SEA 2019
Visit us at Semicon South East Asia 07th – 09th May, 2019. Venue: MITEC , Level 1 Hall 2 & Hall 3, Kuala Lumpur, Malaysia (Booth #807) Continue Reading
Patent Granted for A Unit Lifter Assembly
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “A Unit Lifter Assembly” has been officially granted in Thailand under the Continue Reading
Semicon China 2019
Visit us at Semicon China 20 – 22 Mar, 2019 Venue: Shanghai New International Expo Center at Hall N3, Booth# 3779 Continue Reading
Patent Granted for Assembly and Method for IC unit engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assembly and Method for IC unit engagement “ has been officially granted in South Continue Reading
Semicon Taiwan 2018
Visit us at Semicon Taiwan 05th – 07th Sep, 2018 Venue: TWTC, Nangang Hall, Taipei, Taiwan 4th Floor Booth# :L700Continue Reading
Patent Granted for Method and Apparatus for Improved Sorting of Diced Substrates
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Method and Apparatus for Improved Sorting of Diced Substrates” has been Continue Reading
Semicon SEA 2018
Visit us at Semicon South East Asia 22nd – 24th May, 2018. Venue: MITEC , Level 1 Hall 2 & Hall 3, Kuala Lumpur, Malaysia (Booth #512)Continue Reading
Semicon China 2018
Visit us at Semicon China 14th – 16th Mar, 2018 Venue: Shanghai New International Expo Center at Hall N3, Booth# 3239Continue Reading
Patent Granted for Assembly and Method for IC Unit Engagement
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Assemby and Method for IC Unit Engagement ” has been officially granted Continue Reading
Patent Granted for Dicing System and Method
Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Dicing System and Method ” has been officially granted in Philippines Continue Reading
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