Patent Granted for Processing System and Method for Large Scale Substrates

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings Ltd is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Processing System and Method for Large Scale Substrates” has been officially granted in Singapore under the Patent No. 10201408593T.
Singapore Patent No. 10201408593T will be valid for twenty years from the filing date 11 March 2019.