Patent Granted for Apparatus and Method for Multiple substrate Processing

Rokko Ventures Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled ‘Apparatus and Method for Multiple substrate Processing” has been officially granted in Japan as Patent No. 5420640.

The Japan Patent Number: 5420640 with priority date of 20th May 2010 shall be enforceable for twenty years from that date.