Patent Granted for an improved Ball Mounting Apparatus and Method

Rokko Ventures Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Ball mounting system in integrated circuits entitled ‘An improved Ball Mounting Apparatus and Method’ has been officially granted in Japan as Patent No. 5341768.

The Japan Patent Number: 5341768 with priority date of 22 November 2007 shall be enforceable for twenty years from that date.