Patent Granted for Supply Mechanism for the chuck of an Integrated Circuit dicing device

Rokko Systems Pte Ltd, the Equipment division of Rokko Holdings is pleased to report that its patent related to its flagship Sawing Singulation product entitled “Supply Mechanism for the chuck of an Integrated Circuit dicing device” has been officially granted at Taiwan Intellectual Property Office as Taiwan Patent No. I 387053. The Taiwan Patent No.I 387053 will have a life of twenty years from the application date 23 August 2005.